Samsung Electronics is reportedly developing a new glass substrate for advanced semiconductor packaging. Due to ever-increasing demand for AI chips, the South Korean firm is exploring the use of glass interposers instead of silicon interposers, to cut manufacturing costs and boost performance. Samsung is reportedly focusing on smaller panel prototypes, prioritising an early market launch over initial production efficiency for these next generation AI chips.
Tech
Samsung Reportedly Plans to Replace Silicon With Glass Interposers for Advanced AI Chips by 2028
by aweeincm1
Recent Post
Operation Sindhu: 282 More Indians Evacuated From Iran; Total Reaches 2,858
Another special flight carrying 282 Indian nationals stranded in conflict-hit ... Read more
Grenade Explodes At Security Forces Camp In Assam, 3 Cops Injured
A grenade exploded in a security forces camp in Assam’s ... Read more
Sonam Raghuvanshi, Raj Kushwaha Admitted To Relationship: Cops On Honeymoon Murder
Sonam Rahuvanshi and her boyfriend Raj Kushwaha, who had allegedly ... Read more
Earthquake Of 4.2 Magnitude Hits Andaman Sea
An earthquake measuring 4.2 on the Richter scale struck the ... Read more