Samsung Reportedly Plans to Replace Silicon With Glass Interposers for Advanced AI Chips by 2028

Samsung Electronics is reportedly developing a new glass substrate for advanced semiconductor packaging. Due to ever-increasing demand for AI chips, the South Korean firm is exploring the use of glass interposers instead of silicon interposers, to cut manufacturing costs and boost performance. Samsung is reportedly focusing on smaller panel prototypes, prioritising an early market launch over initial production efficiency for these next generation AI chips.