Xiaomi XRING O1 was unveiled Thursday on the Xiaomi 15S Pro, marking the company’s first in-house chipset. Built on TSMC’s advanced 3nm N3E process technology, the XRING O1 features a 10-core CPU, 6-core NPU, and 16-core GPU. A die shot of the XRING O1 reveals the layout of various components on the chipset.
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Xiaomi XRING O1 Die Shot Reveals Details of 10-Core CPU, 6-Core NPU and More
by aweeincm1
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