Dimensity 9500 SoC is rumoured to be in development as the latest flagship-tier smartphone processor from MediaTek. Ahead of its anticipated debut sometime later this year, a tipster suggests that it could be fabricated using TSMC’s N3P process (3nm). Powered by Arm’s latest Cortex-X9 series cores, the chipset is speculated to bring improvements related to ray tracing and artificial intelligence (AI), the latter supported by a neural processing unit (NPU) capable of delivering 100 tera operations per second (TOPS) performance.
Tech
MediaTek Dimensity 9500 SoC Tipped to Offer Improved Ray Tracing and AI Performance; Specifications Leak
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